glazes interacting at vertical interface

The matrix (i.e. background) glaze and inlay glaze do not overlap before firing.

The matrix glaze is a high alkali metal glaze containing titanium. The inlay glaze is a high
silica full gloss glaze containing copper.

The result a lacy interfacial region surrounding a pool of glassy green.

Several closeups of the interaction region of the two glazes are shown. For context, a picture of the
pot is shown. These closeups are heavily edited to make the artifacts in the interaction region visible.

The background glaze is hiAlk_Z3P_M_hAl, the inlay design is glazed with loAlk_laAl_hiSi_PPK.

The design is created by adhering a mask and then applying the main glaze. After drying,
the mask is removed and the open area filled in with a second glaze, using a bulb syringe
with a needle applicator.



Close up Images of the interaction region

full view

full view

full view

full view



Image of the piece

full view

mug with glaze hiAlk_Z3P_M_hAl and inlay glaze loAlk_loAl_hSi_PPK

mug is ~4 inches high



oxidation firing to cone 10 in an electric kiln

Firing profiles

Up Fire profile cone 10

150 deg F an hour to 250 deg F

400 deg F an hour to 1800 deg F

300 deg F an hour to 2050 deg F

120 deg F an hour to 2310 deg F with a hold of 20 minutes at 2310 deg F

Down Fire Profile cone 10

300 deg F an hour to 1650 deg F then a 3 hr hold at 1650 deg F

400 deg F an hour to 1900 deg F then a 3 hr hold at 1900 deg F

300 deg F an hour to 1750 deg F then a 1 hr hold at 1750 deg F

300 deg F an hour to 1700 deg F then a 3 hour hold at 1700 deg F



Clay body is a grolleg porcelain from Clay Art Center in Tacoma, WA.



glaze composition

Empirical Formula hiAlk_Z3P_M_hAl :

K2O        0.13
Na2O       0.49
CaO        0.36
MgO        0.02

Al2O3      0.63

SiO2       3.43
P2O5       0.06
TiO2       0.21

molecular percent Silica 64.3%



Inlay Glaze:

Empirical Formula loAlk_loAl_hiSi_PPK:

K2O        0.10
Na2O       0.04
CaO        0.63
MgO        0.23

Al2O3      0.44

SiO2       4.5

molecular percent Silica 75.6%

Added:

3.0% Copper Carbonate



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